Production Capacity

Production Capacity

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fr-4

Detailed information:
Layers

4-24 Layers

Mechanical drilling hole

The smallest plated holes 0.2mm

The inner line / space

0.075 mm/0.075mm (H OZ)

The outer line / space

0.1/0.1mm (1 OZ )

Impedance control

+/- 10%

Thick diameter ratio

 Maximum  12:1

The delivery plate size

Maximum:570mm×508mm  Least:50×50mm

The thickness of the plate

<128mil(3.2mm)

The core plate thickness

Least 0.1mm

Pitch

The minimum SMT distance 0.3mm, the minimum BGA distance 0.45mm

Thickness tolerance

±10% (Thick≥0.8mm)
±0.1mm (Thick<0.8mm)

The inner layer base copper thickness

H~6Oz

Outer layer base copper thickness

Multilayer board:T~2Oz
Double sided board:T~5Oz

The inner / outer layer etching tolerance

±20%

Diameter tolerance

Non metallic hole: ± 0.05mm

Metallized hole: ± 0.075mm

 

Hole position tolerance

±0.075 mm

Hole wall roughness (maximum)

0.050mm

Metal shaped hole size (max)

4.5*6.0mm

Drilling long slot size (minimum)

0.5mm

Drilling long groove shape tolerances

Width tolerance: +/-0.05mm

Length tolerance: +0.05/-0.075mm

 

The long slot position tolerance

+/-0.1mm

Kong Jianju (Network)

MIN:0.5mm

Hole wall copper thickness (hole)

≥25um

Hole copper thickness

30um

Inter story drift

0.1mm

The outer layer of graphics on the hole position accuracy (minimum)

±0.075 mm

Graphics graphics precision (minimum)

±0.05mm

Resistance welding precision (minimum)

±0.035mm

Resist thickness

MIN:10um (line surface) 5um (line shoulder angle)

Solder bridge width (min)

0.08mm

Jack aperture

0.2mm~0.65mm

Jack degree two solder coverage (minimum)

80%

Hot air leveling tin thickness

1~40um

Chemical nickel nickel thickness

3~8um

Jin Jin Chemical Nickel thickness

0.05~0.1um

Organic flux protection film thickness

0.2~0.4um

Resistance welding word (minimum)

Type high: 1.0mm word width: 0.15mm

Character (minimum)

Type high: 0.8 mm

Width: 0.12mm

 

Impedance control

+/- 10%

Surface treatment

Lead hot flat, lead-free HASL, chemical deposition of nickel gold, hard gold, electroplating and anti oxidation (OSP), heavy silver gold

ENIG + oxidation, electroplating nickel gold + enig,

Nickel gold plating + hot air leveling, ENIG + hot air leveling

 

Profile tolerance

±0.1mm

Milling angle arc (minimum)

0.4mm

Graphics to milling distance (minimum)

0.25mm

The depth of milling depth tolerance

+/-0.15mm

V- slot angle

15°/25°/30°/60°

Tolerance V- slot angle (minimum)

±10°

Processing V- groove plate thickness

0.5mm~ 2.4 mm

On-off test voltage

50-300V

Insulation resistance

 Testing fixture 2MΩ-100MΩ

On resistance

Clamp for testing 50 Ω -100 Ω

Flying probe test 5 Ω -20 Ω

 

The test grid density (minimum)

50mil

Test pad pitch (minimum)

Clamp for testing 14mil

Flying probe test 4mil

 


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